Microfabrication, thin film processing, trimming processing, micron level, SUS304.
Laser micromachining: thin film processing, trimming processing, micron level, SUS304
【Microfabrication, Thin Film Processing, Trimming Processing, Micron Level, SUS304】 【Material】 SUS304 【Material Dimensions】 Thickness: 0.1mm Remaining Width: 0.05mm 【Processing】 Ultrashort Pulse Laser Processing 【Features】 This product is a trimming process using SUS304 material. Fine processing is performed on a thin film with a thickness of 0.1mm and a remaining width of 0.05mm. This is an example of thin film processing unique to ultrashort pulse lasers. By using an ultrashort pulse laser, physical damage and thermal effects are significantly minimized, allowing for fine processing with minimal burrs. ◆ Fine processing of difficult-to-cut materials and complex shapes ◆ Automotive parts, medical device components, electronic components, semiconductor parts ◆ Prototype and development projects Leave it to us. Hikari Machinery Manufacturing Co., Ltd. ■ HIKARI LASER LAB. 511 Room, Higashikashi Techno Plaza, 5-4-6 Kashiwanoha, Kashiwa City, Chiba Prefecture, 277-0882 Tel. 0471-70-4866 Fax. 0471-70-4866 E-mail: info@hikarikikai.co.jp HP: https://www.hikarikikai.co.jp/
- Company：光機械製作所 HIKARI LASER LAB.
- Price：Other
